Bondexpo Expo Stuttgart Germany

Bondexpo Expo Stuttgart GermanyExhibition Introduction

Bondexpo is the world's number one user meeting place. Through gluing, molding, sealing and foaming, a clear and consistent focus on the joining/bonding process chain provides a detailed system solution to deal with the widest range of bonding Current and future challenges in the field of materials. The same is true for new requirements in terms of resource conservation and material and energy efficiency through material mixing/hybrid design (for miniaturization of lightweight structures or microsystem technology). The bonding technology supplier has found the ideal setting here, which can be shown to professionals in the global production world.

Bondexpo runs in parallel with Motek (International Assembly, Handling Technology and Automated Trade Fair). The trade show is an impressive proof that it requires an out-of-the-box way of thinking in order to be able to fully represent the process chain of production and assembly technology, including the basic bonding and joining technology through bonding.

Bondexpo Expo Stuttgart GermanyScope of exhibits

Adhesives and seals: Raw materials for adhesives and sealants Machines, systems and accessories for adhesive manufacturing Adhesives and sealants Machines, systems and accessories for the adhesive processing industry Sealing, measuring and testing technology

德国胶粘剂及密封展览会Venue

新斯图加特会展中心 New Stuttgart Trade Fair Center

Area：110000

Add：德国 - 斯图加特 - Messepiazza 1, 70629 Stuttgart, Stuttgart