Home Electronic Components Nepcon Expo Shenzhen
亚洲电子生产设备暨微电子工业展览会
5.0
  • Scale

  • Professionalism

  • Evaluation

  • Audience

  • Marketability

Distance
238
days
Held concurrently
The name of the exhibition Date Industry Countdown
2026/10/27~10/29 Monitor 238days away
2026/10/27~10/29 Film and tape 238days away
2026/10/27~10/29 Monitor 238days away

Nepcon Expo ShenzhenExhibition Introduction

Shenzhen Asian Electronics Manufacturing Equipment Exhibition NEPCON ASIA will be exhibited at the Shenzhen Convention and Exhibition Center. The exhibition area is expected to be 60,000 square meters, making it the largest NEPCON exhibition ever. Six exhibitions unite, and strive to build a connected platform for the electronics manufacturing industry. As an international quality exhibition for electronics manufacturing, it is expected that 600 exhibiting companies and brands and tens of thousands of buyers from 38 countries and regions will participate in the NEPCON ASIA exhibition.

The exhibition will display solutions for the entire industry chain: covering PCB, placement, assembly, testing, automotive electronics applications, wiring harness and wiring harness manufacturing. The concurrent meeting will interpret the new engine belts of 5G, new infrastructure, industrial Internet and other industries from the perspective of electronics manufacturing companies The driving force of the coming, as the grand opening after the war, the exhibition will provide electronic manufacturing solutions especially for industrial control, communications, consumer electronics and other industries. The exhibition faces the world's most dynamic Asian electronics manufacturing market, covering thousands of Southeast Asian buyers to fully tap the purchasing power of the Asia-Pacific market.

Nepcon Expo ShenzhenScope of exhibits

Cable: cable manufacturing, plug connector manufacturing technology, coiled product manufacturing, hybrid component manufacturing

PCB: PCB manufacturing, circuit carrier manufacturing, electronic manufacturing services

SMT: Test and measurement technology, quality assurance (A1 and A2), component mounting technology (A2 and A3), production logistics and logistics technology (A2), PCB soldering and connection technology (A4), product surface treatment (A4), Robots in electronics manufacturing (A3)

Semiconductor: Semiconductor manufacturing, manufacturing of displays, LEDs and discrete components, photovoltaic manufacturing, micro/nano production, clean room technology, material processing

Future: Cyber-physical systems, Industry 4.0 in electronics manufacturing/smart factories, 3D printing in electronics manufacturing, IT to production, battery and electrical energy storage manufacturing technology, organic and printed electronics, additive manufacturing

Nepcon Expo ShenzhenExhibition data

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亚洲电子生产设备暨微电子工业展览会Venue

深圳国际会展中心(宝安新馆) Shenzhen World Exhibition and Convention Center Baoan

Area:500000

Add:中国 - 深圳 - 宝安区福海街道展城路1号

Nepcon Expo ShenzhenBuild a plan

  • 9平标准展位A 摊位示意图
    9平标准展位A
    一个咨询台
    一桌两(三)椅
    地毯
    一个垃圾桶
    公司楣板
    两(三)面墙板
    两到四盏射灯
    一个电源插座

    For reference only, the actual booth configuration shall prevail

  • 光地 摊位示意图
    光地
    不含任何设施
    需最小起订面积
    遵守展馆限制

    For reference only, the actual booth configuration shall prevail

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